Hybrid photonic system integration using thin glass platform technology

نویسندگان

چکیده

Demand for high integration of optoelectronic and micro-optical components into micro-electronic systems communication, computing, medical, sensing applications is increasing. Advanced hybrid packaging technologies are used to enhance glass-based substrates featuring electrical, thermal, optical functionalities with laser diodes, modulators, isolators, photonic integrated circuits (PIC), beam-splitting components, micro-lenses. Such can be thin glass layers on large panels or more mini-bench-like boards that embedded organic printed circuit (PCBs). Optical fiber interconnects, connectors, electrical–optical platforms higher level system need miniaturized module board fulfill decreasing channel pitch requirements. We provide background discuss as a suitable base material ion exchanged waveguide interposers, precise structuring posts holders, the related precision assembly techniques, advanced interconnects. Some examples PCB integration, micro-bench sub-assemblies, including PIC, 3D resonator packages combine most these approaches will shown.

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ژورنال

عنوان ژورنال: Journal of optical microsystems

سال: 2021

ISSN: ['2708-5260']

DOI: https://doi.org/10.1117/1.jom.1.3.033501